2.45Ghz Microwave Plasma Cleaner NE-MW05
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DESCRIPTION

NAEN Supplies offers Desktop Microwave Plasma Cleaner System. Microwave plasma cleaning is an advanced dry process using common industrial gases as raw materials, such as oxygen, nitrogen, argon, carbon tetrafluoride and many other gases. This process is rather environmentally friendly and efficient in cleaning; therefore, it has been promoted by more and more industry users.  It is suitable for wafer dry ashing or wafer surface activation and other batch processes. It is widely used in surface treatment related applications like automobiles, batteries, biomaterials, etc. 

Applications

  1. Batch wafer surface activation

  2. Batch wafer photoresist removal 

  3. Removal of MEMS sacrificial layers 

  4. DESCUM process

Microwave Plasma Cleaner NE-MW05 is a compact, high-performance small desktop microwave plasma cleaner designed for R&D and small-scale production applications. The equipment uses the latest high-performance components and software to accurately control process parameters. It is mainly used in semiconductors, optics, electronics, biochips and other fields to perform micro-cleaning, activation, modification, deoxidation, degumming and other applications on the surface of various materials.

Microwave Plasma Cleaner NE-MW05 relies on microwave plasma technology. Microwave plasma has high ionization and dissociation degree, which can produce more active particles, thereby improving the cleaning rate. At the same time, the microwave plasma cleaning machine itself has no internal electrodes, thus eliminating the electrode material pollution caused by the presence of electrodes in the discharge area, which is conducive to high-purity chemical reactions and prolongs the service life, and is suitable for the preparation and treatment of high-purity materials. In addition, the entire discharge process does not require positive and negative electrodes, the self-bias voltage generated is extremely small, and the ion energy in the plasma is low, which minimizes the exposure of the product to electrostatic discharge (ESD) and fundamentally avoids product surface damage. Therefore, microwave plasma cleaning technology is very suitable for application in semiconductor chip packaging.

PARAMETER

ENCLOSUREDimensions730 × 584 × 382 mm(L × W × H)

PLASMA POWER SUPPLY 

Power0-1000W, continuously variable output
Frequency2.45GHz

CHAMBER

MaterialQuartz
Dimensions160 × 274 mm(Φ × H), 5.5L
Effective Processing Area140 × 260 mm(W × D)

PROCESS CONTROL

InterfacePLC with 7'' Touch Screen HMI
Gas Channelsx2 MFC, compatible with O₂, Ar, N₂, H₂, etc.
Pressure GaugePirani Sensor

SERVICES

Electrical220 VAC, 50-60Hz
Power CordSuited to region
ComplianceCE


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

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